Tender
Expression of Interest (EOI) for Empanelment of the Technology Service Providers (TSP) for providing technology resources for various Applications and Digital initiatives at LIC
| Date | 20/03/2026 |
| Tender Document 1 | RFP-TSP_20032026_Final |
| Tender Document 2 | Pre_Bid_Responses |
| Tender Document 3 | Corrigendum 1 |
Last modified date : Wed, 15 Apr 2026 10:35:44 +0000
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